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博思數(shù)據(jù)研究中心

Global and China Advanced Packaging Industry Report, 2009-2010

2010-09-25                  來源:博思數(shù)據(jù)研究中心              
字體大。
導(dǎo)讀: 【Table of Contents】 1 Status Quo and Future of IC Advanced Packaging 1.1 Profile of IC Packaging 1.2 Types of IC Packaging 1.2.1 SOP 1.2.

2002-2010
Revenue and Operating Margin of Greatek Electronics, 2002-2010
Monthly Revenue of Greatek Electronics, Jan.2008 -Jul.2010
Quarterly Revenue and Gross Margin of Greatek Electronics,
2007Q1-2010Q2
Capital Expenditure of Greatek Electronics, 2004-2011E
Revenue of Greatek Electronics by Technology, 2007-2010
Capacity Utilization Rate of Greatek Electronics, 2008Q1-2010Q2
Revenue and Gross Margin of FATC, 2002-2010
FATC Organizational Structure
Capital Expenditure of FATC, 2002-2010
Revenue and Gross Margin of PTI, 2005-2011E
Revenue and Operating Margin of PTI, 2005-2011E
Monthly Revenue of PTI, 2008Q1-2010Q2
Capital Expenditure of PTI, 2003-2010
Client Structure of PTI, 2010
Revenue of PTI by Package Type, 2010Q1&Q2
Capacity of PTI Production Lines, 2009-2010
Revenue and Gross Profit of ChipMOS, 2001-2009
EBITDA Margin of ChipMOS, 2003-2010 
Cash Flow of ChipMOS, 2010Q2
Revenue of ChipMOS by Product, 2006-2009
Revenue of ChipMOS by Region, 2006-2009
Technical Capability of ChipMOS
Revenue of ChipMOS (by Sector), 2010Q2
Revenue of ChipMOS by Product, 2010Q2
Revenue and Gross Margin of KYEC, 2003-2010
KYEC Organizational Structure

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